Master Bond single-component adhesives

No mix, single component system Serviceability from 4K to +400°F Unlimited working life at room temperature Resistance to mechanical and thermal shocks Withstands 1,000 hours 85°C/85% RH Master ...

Excellent physical strengths No mix, single component system Serviceability from 4K to +400°F Silver conductive Resistance to mechanical and thermal shocks Master Bond Supreme 10HTS is a user friendly, ...

... impressive combination of easy and straightforward processing along with an array of superb properties after curing. It is a single component system that cures at 125°C (257°F) in 60-70 minutes and 150°C ...

... applications where protection is needed from flames, smoke and materials that might burn; particularly, electronic components. This one component system is primarily used for potting but can also be used ...

... coating, its main use is as an adhesive for die attach and general bonding purposes. EP3HTS-TC bonds well to a wide variety of substrates including metals, composites, ceramics, and many plastics. As a die attach adhesive, ...

... Thixotropic Epoxy Features Low Coefficient of Thermal Expansion frozen epoxy with a very low coefficient of thermal expansion (CTE), high glass transition temperature (Tg), and extremely high modulus Key Features -Unlimited working ...

... dam-and-fill applications. It is a no mix system with a curing schedule of 185°F for 2 to 3 hours. Aside from its use as an adhesive, it is also used for chip on board encapsulations. After curing, it blocks the flow ...

Excellent physical strength properties High dimensional stability Superior temperature and chemical resistance Not oxygen inhibited Master Bond UV24TKLO is a one part, modified epoxy acrylate UV curable system for bonding, sealing ...