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- Master Bond
Master Bond single-component adhesives
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No mix, single component system Serviceability from 4K to +400°F Unlimited working life at room temperature Resistance to mechanical and thermal shocks Withstands 1,000 hours 85°C/85% RH Master ...
Master Bond Inc.
Excellent physical strengths No mix, single component system Serviceability from 4K to +400°F Silver conductive Resistance to mechanical and thermal shocks Master Bond Supreme 10HTS is a user friendly, ...
Master Bond Inc.
... impressive combination of easy and straightforward processing along with an array of superb properties after curing. It is a single component system that cures at 125°C (257°F) in 60-70 minutes and 150°C ...
Master Bond Inc.
... applications where protection is needed from flames, smoke and materials that might burn; particularly, electronic components. This one component system is primarily used for potting but can also be used ...
Master Bond Inc.
... fine particle size Can cure up to 1/4 inch thick High modulus and compressive strength Master Bond EP4EN-80 is a one component, low viscosity epoxy mainly for potting applications. Curing is simple and straightforward, ...
Master Bond Inc.
... coating, its main use is as an adhesive for die attach and general bonding purposes. EP3HTS-TC bonds well to a wide variety of substrates including metals, composites, ceramics, and many plastics. As a die attach adhesive, ...
Master Bond Inc.
Paste consistency Ultra fine particle size Superior thermal conductivity Master Bond EP5TC-80 is a one component, flowable paste epoxy for bonding, sealing and small encapsulation applications. EP5TC-80 is a special ...
Master Bond Inc.
Not premixed and frozen Paste consistency Master Bond EP17HTDA-2 is a one component, heat cured epoxy system for bonding, sealing, and die attach applications. It does not require any mixing and the curing temperature ...
Master Bond Inc.
... low CTE product is desirable. Some recent applications are in fiber optic packaging, including mounting optics and other components, and bonding fibers into ferrules. In microelectronics, low CTE’s are used for bonding ...
Master Bond Inc.
... excellent thermal conductivity, superior electrical insulation and the ability to withstand rigorous thermal cycling. This one component, non-mix system, which is not premixed and frozen, has an unlimited working life ...
Master Bond Inc.
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