Multichannel flaw detector USIP|xs CV
ultrasonicdigitalfor aeronautics

Multichannel flaw detector - USIP|xs CV - Waygate Technologies - ultrasonic / digital / for aeronautics
Multichannel flaw detector - USIP|xs CV - Waygate Technologies - ultrasonic / digital / for aeronautics
Multichannel flaw detector - USIP|xs CV - Waygate Technologies - ultrasonic / digital / for aeronautics - image - 2
Multichannel flaw detector - USIP|xs CV - Waygate Technologies - ultrasonic / digital / for aeronautics - image - 3
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Characteristics

Technology
ultrasonic
Options and accessories
digital, multichannel
Applications
for aeronautics

Description

The improved multi-instrument architecture provides more flexibility and helps you to optimize your automation capabilities. As the successor of the USIP 40 multi-channel flaw detector, the newly available Krautkrämer USIP|xs CV solves a growing need for easy, cost-effective integration. The improved multi-instrument architecture helps to optimize automation capabilities and provides more interfaces and flexibility. The USIP|xs CV can be integrated into any automated and semi-automated inspection system. With different T/R specifications and multitude of channel configurations, the instrument is scalable in performance as well as associated cost. As a result, it is well suited for a wide range of applications and system sized, such as Quality Assurance, Press Control and R&D. Best automation capabilities Effective integration into automated systems of any complexity Integrated field bus connection enables for a single cable connection ton any PLC & significantly reduces wiring efforts when designing larger systems Synergies of a scalable platform Perfectly fitted to the individual customer need Creates synergies concerning: technical infrastructures, Training/Integration know-how, Life cycle support, spare parts handling Ease of use and operation Latest usability standards, vast integrated diagnostics features: reduced training, learning efforts, fast start up and maintenance Integrated box design superior to slot card design systems: widely reduces number of parts and interfaces, reduced probability of failure Plug and play - TÜV approved EMC and Safety: saves time, risk and cost compared to UT PCB suppliers

Catalogs

USIP|xs CV
USIP|xs CV
4 Pages

Exhibitions

Meet this supplier at the following exhibition(s):

Formnext Chicago
Formnext Chicago

8-10 Apr 2025 Chicago (USA - Illinois)

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    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.