Data analysis software TecView™ BT

data acquisitionfor aeronauticsprocess

TecView™ BT is a true Windows® based software designed for non-destructive Bond Testing inspections, from data Acquisition to data Analysis. It is designed for inspection of bond quality of aerospace composite materials. With its intuitive interface, the TecView BT automates the process of bond testing. It records the output signal of a bond testing instrument and provides C-Scan imaging capabilities, which would allow more intuitive and accurate analysis possibilities in terms of defect detection, sizing and positioning. C-Scan imaging can provide useful additional data that can complement the results of specialized non-destructive bond testing. In addition, C-scan imaging provides an intuitive representation of the inspection data that allows recognizing geometrical patterns within multiple readings.