The EddyCus® TF map 5050 Series is a high-resolution non-contact imaging device series for sampling areas up to 500 x 500 mm (20 x 20 inch). The bench-top device automatically measures at various measurements points, typically with a pitch in X and Y of 1 mm (40 mil) generating accurate mappings. The system acquires hundreds of measurements per second on the fly resulting in high resolution images containing up to 250,000 measurement points per sample. The bench-top devices allow depending of its setup the precise imaging of metal thickness, sheet resistance or electrical anisotropy. The resulting property images provide a deep insight to layer homogeneity and defect density and hence offer a profound basis for material and process optimization. Applications involve quality assurance for sputtering, evaporation, ALD, CVD, electroplating or doping and annealing processes.
Highlights
Non-contact imaging
Fast and accurate
High resolution imaging with 1 mm pitch (alternatively 0.25 to 10 mm)
Sampling areas of 500 x 500 mm (20 x 20 inches)
Advanced layer uniformity analysis and defectoscopy
Characterization of hidden and encapsulated conductive layers
Profound software-integrated analysis functions (line profiles, histogram analysis, selective area analysis, statistics)
Hybrid systems (e.g. combined electrical and optical imaging)
Systematic quality control, incoming inspection, inspection of outgoing goods
Types
Devices are offered with different sensor configurations using eddy current sensors of optical components.
Characteristics
Technology: non-contact eddy current sensor
Sampling area: 500 x 500 mm