Film FEP FG

aeronautical

FEP films offer excellent chemical resistance and release properties, and can also be easily fabricated. Compared to PFA, FEP films are lower in cost and temperature, and they have a low dielectric constant and dissipation with a continuous use temperature of 400°F (205°C), suitable for use in cryogenic and high temperature applications. We offer four different options for FEP film: CHEMFILM FEP-FG, general purpose film, is manufactured from fluoroinated ethylene propylene resin. This film grade provides a low dielectric constant and excellent dissipation over a wide range of temperatures, from -425°F to 400°F (-254°C to 205°C), and frequencies for low signal distortion and attenuation in flexible printed circuit and flat cable applications. BENEFITS: Outstanding anti-stick release properties Superior dielectric and electrical insulation properties Exceptional chemical resistance in aggressive environments UV stable: long term performance in outdoor applications CHEMFILM FEP-FS film is made from high molecular weight fluorinated ethylene propylene resin for applications where high flex life and stress-crack-resistant performance are required, such as tank linings and diaphragms. Its temperature performance BENEFITS: High molecular weight resin offers excellent stress crack resistance and flex life Outstanding anti-stick release properties Superior dielectric and electrical insulation properties Exceptional chemical resistance in aggressive environments