Impedance tester BondHub II

bondingmaterialaeronautical

Measure the mechanical strength of bonds ultrasonically with the BondHub II. The BondHub II system consists of a computer, scanner drivers, and displays combined with the power of our Bondascope 3100. The BondHub’s operating software includes industry-standard bond testing methods and provides the freedom for the operator to choose which test method to utilize on each test object. The available modes include Pitch/Catch, MIA (Mechanical Impedance Analysis), and Resonance. Ultrasonic Testing on a Wide Range of Materials The BondHub II excels at composite materials testing. While these materials have been used in aviation for many years, many new processes and materials have been introduced in the last decade to improve the consistency and reliability of these composites. However, the technologies needed to inspect composite materials have lagged. Fortunately, that’s changing quickly thanks to instruments like the BondHub II. The BondHub works very well on multi-layered laminates, glass fiber/carbon fiber composites, honeycomb and foam cores, metal to metal bonding, and adhesively bonded fittings. Typical defects revealed include delaminations, disbonds, crushed core, skin to core flaws, far-side defects, impact damage, liquid ingress, and more. Power and Flexibility The BondHub II connects directly to the Bondascope 3100 and combines the Bondascope’s Amplitude and Phase Angle data with the XY encoder inputs from any scanner to create a C-Scan image. Data Analysis Tools, such as defect sizing, multiple gates, adjustable Null, and reporting capabilities are all on board. It is a battery-operated system, compact and easily deployable.