Epoxy adhesive EP53TC

glassfor aeronauticsfor bonding

Two part epoxy with high thermal conductivity, electrically insulating, and low thermal resistance for bonding, sealing, coating, and potting Key Features Applicable in very thin bond lines Low thermal resistance High thermal conductivity >2.0 W/(m•K) Flowable Master Bond EP53TC is a thermally conductive, electrically insulating two part epoxy that combines good physical properties and the ability to transfer heat rapidly and effectively. EP53TC has a forgiving 100 to 5 mix ratio by weight. The working life ranges from 6-8 hours. This epoxy cures at 80°C for 2 hours followed by 90-120 minutes at 125°C. An alternative cure schedule would be 4-6 hours at 80-90°C. The hallmark of this system is good thermal conductivity, reliable electrical insulation, and the ability to be used for encapsulation applications. A special feature of this material is its small particle fillers ranging in size from 5 to 30 microns. When bonding, this allows the epoxy to be applied in especially thin sections resulting in very low thermal resistance. Thermally conductive epoxy usually has a thermal resistance ranging from 30-45 x 10-6 K•m2/W. With EP53TC the thermal resistance is significantly lower because of the high conductivity filler and the ultra small particle size (10-15 x 10-6 K•m2/W). The end result is the epoxy is very effective in transferring heat. The lower the thermal resistance, the better it is for heat transfer properties. The system bonds well to a wide variety of substrates, including metals, composites, glass, ceramics and many plastics. Other attributes include a very low coefficient of thermal expansion, low shrinkage upon curing and exceptional dimensional stability.