Epoxy adhesive EP21TDCS-LO

for metalsfor plasticsglass

Low volume resistivity Cryogenically serviceable Passes ASTM E595 for NASA low outgassing Master Bond EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing. It is formulated to cure at room temperature or more rapidly at elevated temperatures. The optimum cure schedule is overnight at room temperature followed by 2-3 hours at 135-165°F. Unlike many two part silver conductive epoxy systems, EP21TDCS-LO has a one to one mix ratio by weight or volume. Both parts A and B are paste consistency and after mixing, the system is essentially nondrip. It is 100% reactive and does not contain any diluents or solvents. After curing, the system has several attractive features including very low volume resistivity. EP21TDCS-LO bonds well to a wide variety of substrates such as metals, glass, composites, ceramics, as well as many plastics. It is a toughened system which allows it to withstand rigorous thermal cycling and shock. This silver conductive epoxy has a service temperature range extending from 4K to +275°F. It is NASA low outgassing tested and approved. EP21TDCS-LO has been successfully used in sophisticated aerospace, optical, electro-optic, semiconductor, specialty OEM and related applications. For convenient handling, EP21TDCS-LO is available in premixed and frozen syringes. Product Advantages Easy to use mix ratio of 1 to 1 by weight or volume Paste consistency Cures at ambient or elevated temperatures Highly electrically and thermally conductive Excellent toughness Resists thermal cycling Passes NASA low outgassing testing