Epoxy adhesive EP4EN-80

for aeronauticsfor bondinglow outgassing

Ultra fine particle size Can cure up to 1/4 inch thick High modulus and compressive strength Master Bond EP4EN-80 is a one component, low viscosity epoxy mainly for potting applications. Curing is simple and straightforward, 90 minutes at 65°C plus 30 minutes at 80 to 85°C. The working life is 12-24 hours and any leftover material can be returned to the refrigerator for future use. It has a thermally conductive, electrically insulative filler material with ultra small particle sizes. This imparts high mechanical strength properties, outstanding dimensional stability and low shrinkage upon curing. EP4EN-80 is primarily for potting and encapsulation up to 1/4 inch thick. It is very low in viscosity and free flowing. Usually one part epoxies are too exothermic to be used in this fashion, but this system is specially formulated for lower heat generation. EP4EN-80 bonds well to a variety of substrates such as metals, composites, ceramics and many plastics. It is electrically isolating and transfers heat very effectively. Also noteworthy is its high modulus and compressive strength. EP4EN-80 can also be used as an adhesive. Because the particles are so small it can be applied in thicknesses ranging from 10-15 microns. The combination of thin bond lines and thermal conductivity lowers the thermal resistance to 10-20 x 10-6 K•m2/W. This is a big positive in managing heat related issues. EP4EN-80 will resist waters, oils and fuels. Its color is gray.