Epoxy adhesive Redux® 609

for aeronauticsfor bondingfor metals

Redux® 609 is a 120°C curing modified epoxy film adhesive containing a cotton scrim for easy handling and glue-line thickness control. It is available at standard areal weights of 200g/m2 and 300g/m2 . An unsupported version with areal weight 300g/m2 is also available. Features Flexible cure cycle Good lap shear performance at temperatures ranging from -55°C to 80°C Good peel properties from -55°C to 80°C Good properties in sandwich structures from -55°C to 80°C Good tack to assist in adhesive joint assembly Less than 1% volatile content Suitable for bonding a wide range of substrates Applications Aluminium to aluminium bonding Sandwich bonding with a variety of skins and cores Form Blue, supported, flexible film adhesive having the following dimensions: The film is protected on one side by polythene and on the other side by release paper. Instructions For Use Pretreatment It is essential that all substrates of the final bonded structure to be used are free of contamination and in as ideal a state for bonding as possible. As pretreatment will significantly vary dependent on substrates being used, please refer to the Hexcel publication Redux® Bonding Technology for optimum procedures. If there will be a delay between pretreatment and bonding of aluminium, the pretreated surface can be protected with Redux® 112 to conserve the good bonding surface. Bonding can be delayed for up to 2 months without deterioration of the pretreated surface.