Epoxy adhesive REDUX® 312 series

for aeronauticsfor bonding

Redux® 312 is a high strength 120°C curing film adhesive, suitable for metal to metal bonding and sandwich constructions, where operating temperatures of up to 100°C may be experienced. A supported version, Redux® 312/5, is available with a woven nylon carrier for bond line thickness control. Features Short cure cycle - cures in 30 minutes at 120°C Good mechanical performance up to 100°C Suitable for composite to composite bonding Low volatile content (solventless process) Applications Metal to metal bonding Sandwich constructions Composite to composite bonding Forms Grey flexible film adhesive, available in 5 areal weights; 4 in unsupported form and one with a woven nylon carrier. Instructions For Use Pretreatment It is essential that all substrates to be used are free of contamination and are in as ideal a state for bonding as possible. As pretreatment varies significantly depending on the substrates used, please refer to the Hexcel Composites publication Redux® Bonding Technology for optimum procedures. If there is to be a delay between the pretreatment and bonding of aluminium, the pretreated surface should be protected with Redux® 112 surface pretreatment protection solution to conserve the optimum bonding surface. This will enable bonding to be delayed for up to 3 months without deterioration of the pretreated surface. The correct application of Redux® 112 should not alter the bonding performance of Redux® 312 (for full application details consult the relevant data sheet).