Epoxy adhesive Redux® 200 series

for aeronauticsfor bonding

The HexBond™ 200 series is a range of foaming adhesive films presented in sheet form. They expand during the cure cycle to fill gaps and adhere strongly to all parts of the structure with which they come into contact. HexBond™ foaming adhesive films are compatible with HexBond™ film adhesives as follows Features High strength at temperatures from -55°C to 220°C. Less than 1% volatiles emitted during cure. Suitable for aluminium and fibre-reinforced composite sandwich constructions. Expansion ratios from 1:2.0 to 1:2.2 Applications Joining honeycomb core sections. Bonding of honeycomb core to edge members. Bonding inserts into sandwich structures. Form Dry flexible films of dimensions 1.25 m x 0.2 m, and with a standard thickness of 1.52 mm, lined on both sides with protective covers. A standard pack contains 8 sheets of the above dimensions. Pretreatment It is essential that all substrates to be used are free of contamination and in as ideal a state for bonding as possible. As pretreatment will significantly vary dependent on substrates being used, please refer to the Hexcel publication HexBond™ Bonding Technology for optimum procedures.