Coating thickness gauge CMI760®

digital displayfor aeronauticsfor NDT

TEST FOIL, LAMINATE, SURFACE, TRACES AND THRU-HOLE COPPER WITH A SINGLE DEVICE The CMl760® accepts multiple probe types to meet almost any PCB application, including surface copper and through-hole applications. Our CMl760® comes standard with the SRP-4 probe and an advanced statistical package for interpretation of test data. This instrument is highly-expandable, capable of both micro-resistance and eddy current testing for the accurate and precise measurement of copper. Optional accessories are available to measure thru-hole copper thickness. SRP-4 PROBE The CMI760® includes a tethered SRP-4 Probe with user-replaceable tips for added convenience and its more cost effective. This probe consists of four pins encased securely in a patented design for durability and resistance to breakage and wear. A see-through casing allows for easy placement of the probe on small traces. The tethered cable is ideal for field applications plus its small footprint is convenient and user-friendly. OPTIONAL ETP PROBE Using our ETP Probe the CMI760® operates with eddy current for through-hole measurements. This probe generates accurate readings regardless of the board’s multiple layers, working equally well on double-sided and multilayer boards, before and after etch, even with tin and tin/lead resist. It also provides a temperature compensation feature, for measurement of the board immediately after it is lifted from the plating tank. GAUGE SPECIFICATIONS Dimensions: in : 11 1/2 (W) x 10 1/2 (D) x 5 1/2 (H) cm: 29.21 (W) x 26.67 (D) x 13.97 (H). Weight: 6 lbs. (2.7 kg). Unit: Select from mils, µm, µin, mm, in., or % as units for display. Display: Large LCD 480 (H) x 320 (V) pixels