Advanced surface copper measurement on single, double-sided, or multi-layer PCB
MICRORESISTANCE TECHNOLOGY FOR ACCURATE MEASUREMENT OF SURFACE COPPER
The CMI563® provides advanced technology for accurate measurement on copper plating and it ensures that the opposite side of the PCB will not interfere with readings, regardless of laminate thickness. Our CMI563® makes it simple to obtain precise surface copper measurement on laminate, electroless, or electrolytic copper.
This gauge is an ideally suited for:
PCB manufacturing and assembly.
Copper surface thickness.
Our CMI563® provides superior performance for copper foil measurement on flexible or rigid, single, double-sided, or multi-layer boards.
SRP-4 PROBE Included standard with the CMI563® gauge is a tethered SRP-4 probe with user-replaceable tips. This patented probe design consists of four pins securely encased for durability. Its see-through casing allows for easy placement. The tethered cable is ideal for field applications, and it has a small footprint for convenience.
MICRORESISTANCE TECHNOLOGY
Microresistance makes the CMI563® highly accurate for electroless and electrodeposited copper applications, and even works on fine trace measurements. It uses four-point contact to generate an electrical signal. A current is passed between the outer pins, and voltage drop is measured between the inner pins of the sample.
SRP-4 USER REPLACABLE PROBE TIPS (PATENT 7,148,712)
Easily replace a broken probe tip.
| Optional NIST-traceable check standards to match a variety of thickness ranges.
| One replacement probe standard, additional probe tips available (packages of 3).