Sheet copper alloy

blockfor the aerospace industry

Thermal Management Materials We develop Molybdenum-Copper (AMC) and Tungsten-Copper (AWC) composites through wrought powder technology with unique properties for the electronics industry including: heat sinks, substrates, thermal spreaders, machined components, and material blanks. Due to their excellent thermal conductivity and controlled thermal expansion, our Molybdenum-Copper and Tungsten-Copper composites are the preferred materials for Gallium Arsenide (GaAs) and Gallium Nitride (GaN) semiconductors for the defense industry. Our products are trusted in sensitive applications such as advanced active radars, electronic countermeasures, and jamming equipment. All of our thermal management products are offered as raw material in sheet or block form but we also maintain the capabilities to vertically integrate for turnkey solutions. These include sized pedestals via Electrical Discharge Machining (EDM), high tolerance machining, plating and packaging options such as waffle packs. Specifications Molybdenum-Copper and Tungsten-Copper material is available as finished parts with the following maximum dimensions depending on overall size Width: 4 inches (102 mm) Thickness: 3 inches (76 mm) Length: 24 inches (610 mm) Our wrought powder metallurgy composites products can be machined into shapes and readily plated and have superior through-thick-ness thermal conductivity versus other products. Furthermore, our ability to process into net shape and block form allow us to offer these materials for further machining into finished package products.