Single component high solids compound designed to fill pinholes in glass laminates and pores of open grained woods prior to finishing with epoxy or polyurethane coatings.
Key benefits
Combines chlorinated resins with selected filler pigments and is packaged in ready to use form.
Resin content is compatible with most epoxy and polyurethane surfacers and topcoats, and reacts with the applied coating to tightly bind filler particles.
Product Characteristics
Gloss Level
N/A
Delivery Method
Solventborne
Coverage
21.5 m² per liter ready to apply at 25.4 µm dry film thickness 877 ft² per US gallon ready to apply at 1 mil dry film thickness
Subsegment
Aircraft Structures
Application
OEM/Specifier & Specs Qualified
OEM/Specifier
Specs Qualified
Bell Helicopter - Textron
299-947-144
Raytheon
772254-3
AkzoNobel
Certification
Boeing Long Beach
DPM 6432, COMP C
General Electric
A15B174
Ilyushin
И756.18.619
TRW
3231894
CASA (EADS)
Z-12.204
Comac
CMS-CT-903
Irkut
741.140/21-00-00-0038-0T04/0B
Boeing
BAC 5837
Lockheed Martin Corp
G37.5350
McDonnell Douglas
MDM 15-1095 () 24
Northrop Grumman
GC146AR1