{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
... ceramics and many plastics. The cured epoxy is a superior electrical insulator. Its natural color is gray, but other colors are available. Its viscosity is very high, although it has a small amount of flow when initially ...
Excellent physical strengths No mix, single component system Serviceability from 4K to +400°F Silver conductive Resistance to mechanical and thermal shocks Master Bond Supreme 10HTS is a user friendly, one component, silver conductive ...
... two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. EP29LPSP is serviceable at temperatures as low as 4K as an adhesive, ...
... achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1031 AT-S can withstand severe thermal cycling, ...
KOHESI BOND
Kohesi Bond TUF 1820 AOHT is a noteworthy toughened, single component epoxy system that requires no mixing and offers an unlimited working life at room temperature. It cures in merely 60 – 70 minutes at 120°C and even faster at higher ...
KOHESI BOND
Kohesi Bond KB 1039 CRLP is a two component, heat curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 100:65 (Part A: Part B) mix ratio by weight. This unique epoxy ...
KOHESI BOND
... achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours. KB 1040 P is optically clear and offers top notch ...
KOHESI BOND
... achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours. KB 1031 AT-2LO can withstand severe thermal shocks ...
KOHESI BOND
... followed by a heat cure at 70°C – 90°C for 3 – 5 hours. TUF 1621 AOHT is thermally conductive and it can withstand very high temperatures. It offers an extensive serviceable temperature range of -70°C to +200°C. This ...
KOHESI BOND
Please specify:
Help us improve:
remaining