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... of ultra fast curing and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures (Tg) below 85°C, EP65HT-1 has an exceptional Tg ...
... shrinkage upon cure. Also, it has outstanding physical properties and electrical insulation values. EP41S-1 can be used as an adhesive, sealant, coating, potting or encapsulating material. It is serviceable over the wide ...
... premixed and frozen Very long open time at room temperature Cures rapidly at 250-300°F Master Bond EP3HTS-TC is a fast curing, silver filled, one part epoxy with unparalleled electrical and thermal ...
Kohesi Bond TUF 1820 AOHT is a noteworthy toughened, single component epoxy system that requires no mixing and offers an unlimited working life at room temperature. It cures in merely 60 – 70 minutes at 120°C and even faster at higher ...
KOHESI BOND
Kohesi Bond KB 1040 P is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique epoxy system ...
KOHESI BOND
... cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +120°C. It is a phenomenal adhesive that fosters outstanding physical strength properties and yet consolidates high peel ...
KOHESI BOND
Kohesi Bond TUF 1621 AOHT is a two component, room temperature curing epoxy system suitable for bonding and sealing. It is capable of passing NASA standards for low outgassing (ASTM E-595) and has a convenient 1:1 (Part ...
KOHESI BOND
Kohesi Bond TUF 1820 ANHT is a toughened, single component epoxy system that offers phenomenal thermal conductivity while maintaining its superior electrical insulation properties. It requires no mixing and offers an unlimited working ...
KOHESI BOND
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