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Fast-curing adhesives
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... of ultra fast curing and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures (Tg) below 85°C, EP65HT-1 has an exceptional Tg ...
EP41S-1 Product Information Two component, epoxy adhesive, sealant and coating resists harsh chemicals Key Features Low viscosity Ambient temperature cures 100% reactive Outstanding chemical resistance Bonds ...
One component, silver filled epoxy features extraordinary electrical and thermal conductivity. Key Features: For bonding, sealing and coating Not premixed and frozen Very long open time at room temperature Cures rapidly at 250-300°F Product ...
Kohesi Bond TUF 1820 AOHT is a noteworthy toughened, single component epoxy system that requires no mixing and offers an unlimited working life at room temperature. It cures in merely 60 – 70 minutes at 120°C and even faster at higher ...
KOHESI BOND
Kohesi Bond KB 1040 P is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique epoxy system ...
KOHESI BOND
... cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +120°C. It is a phenomenal adhesive that fosters outstanding physical strength properties and yet consolidates high peel ...
KOHESI BOND
Kohesi Bond TUF 1621 AOHT is a two component, room temperature curing epoxy system suitable for bonding and sealing. It is capable of passing NASA standards for low outgassing (ASTM E-595) and has a convenient 1:1 (Part ...
KOHESI BOND
Kohesi Bond TUF 1820 ANHT is a toughened, single component epoxy system that offers phenomenal thermal conductivity while maintaining its superior electrical insulation properties. It requires no mixing and offers an unlimited working ...
KOHESI BOND
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