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... coating, its main use is as an adhesive for die attach and general bonding purposes. EP3HTS-TC bonds well to a wide variety of substrates including metals, composites, ceramics, and many plastics. As a die attach adhesive, ...
... serviceable Passes ASTM E595 for NASA low outgassing Master Bond EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing. ...
Kohesi Bond KB 1031 AT-S is a two component, silver filled, electrically conductive epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. It offers ...
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